1 p-channel 30-v (d-s) mosfet fe atures ? halogen-fr ee according to iec 61249-2-21 available ?trenchfet ? p ower mosfet ? 100 % r g tested ? 100 % uis tested applic ations ? load switches - notebook pcs - desktop pcs p roduct summary v ds (v) r ds(on) ( ) i d (a ) d q g (t yp.) - 30 0.018 at v gs = - 10 v - 13 22 nc 0.030 at v gs = - 4.5 v - 10 notes: a. surface mounted on 1" x 1" fr4 board. b. t = 10 s. c. maximum under steady state conditions is 85 c/w. d. based on t c = 25 c . absolute maximum ratings t a = 25 c, unless otherwise noted p arameter symbol limit unit drain-source voltage v ds - 30 v gate-source v oltage v gs 25 c ontinuous drain current (t j = 150 c ) t c = 25 c i d - 13 a t c = 70 c - 10. 5 t a = 25 c - 8 .7 a, b t a = 70 c - 7 .7 a, b pulsed dr ain current i dm - 50 c ontinuous source-drain diode current t c = 25 c i s - 4.6 t a = 25 c 2.0 a, b a valanche current l = 0.1 mh i as - 20 single-pulse a valanche energy e as 20 mj maximum power dissipation t c = 25 c p d 5.6 w t c = 70 c 3.6 t a = 25 c 2.5 a, b t a = 70 c 1.6 a, b oper ating junction and storage temperature range t j , t stg - 55 to 150 c t hermal resistance ratings p arameter symbol typical maximum unit maximum junction-to-ambient a, c t 10 s r th ja 39 50 c/w maximum junction-to-foot steady state r th jf 18 22 s g d p-channel mosfet s s d d d s g d so-8 5 6 7 8 t op view 2 3 4 1 dt . www. daysemi.jp
2 no tes: a. pulse test; pulse width 300 s, duty cycle 2 %. b. guaranteed by design, not s ubject to production testing. st resses beyond those listed under ?absolute maximum ratings? ma y cause permanent damage to the device. these are stress rating s only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. exposure to absolute maximum rating conditions for extended periods may affect device reliability. s pecifications t j = 25 c, unless otherwise noted p arameter symbol test conditions min. typ. max. unit static drain-source breakdo wn voltage v ds v gs = 0 v , i d = - 2 50 a - 30 v v ds t emperature coefficient v ds /t j i d = - 250 a - 31 mv /c v gs( th) t emperature coefficient v gs(th) /t j 5. 5 gate-source threshold voltage v gs(t h) v ds = v gs , i d = - 250 a - 1.0 - 3.0 v gate-source leakage i gss v ds = 0 v , v gs = 25 v 100 na zero gate voltage drain current i dss v ds = - 30 v , v gs = 0 v - 1 a v ds = - 30 v , v gs = 0 v , t j = 55 c - 5 on-state drain current a i d( on) v ds - 10 v , v gs = - 10 v - 30 a drain-source on-state resistance a r ds( on) v gs = - 10 v , i d = - 10 a 0. 014 0.018 v gs = - 4.5 v , i d = - 7 a 0.0 245 0.030 forward transconductance a g fs v ds = - 10 v , i d = - 10 a 23 s dy namic b inpu t capacitance c is s v ds = - 15 v, v gs = 0 v , f = 1 mhz 1960 pf output capacitance c oss 380 re verse transfer capacitance c rs s 325 t otal gate charge q g v ds = - 15 v , v gs = - 1 0 v, i d = - 10 a 43 65 nc v ds = - 15 v , v gs = - 4.5 v, i d = - 10 a 22 33 gate-source charge q gs 6 gate- drain charge q gd 11 g ate resistance r g f = 1 mhz 0.3 1.3 2.5 tu r n - o n d e l ay t i m e t d( on) v dd = - 15 v , r l = 3 i d ? - 5 a, v gen = - 10 v , r g = 1 11 22 ns rise time t r 13 25 turn-off delaytime t d( off) 32 50 fall time t f 91 8 tu r n - o n d e l ay t i m e t d( on) v dd = - 15 v , r l = 3 i d ? - 5 a, v gen = - 4.5 v , r g = 1 44 70 rise time t r 100 160 turn-off delaytime t d( off) 28 50 fall time t f 15 30 drain -source body diode characteristics continuous source-drain diode current i s t c = 25 c - 4.6 a pulse diode forward current i sm - 50 body diode v oltage v sd i s = - 2 a, v gs = 0 v - 0.75 - 1.2 v body diode reverse recovery time t rr i f = - 2 a, di/dt = 100 a/s, t j = 25 c 28 45 ns body diode reverse recovery charge q rr 20 40 nc reverse recovery fall time t a 13 ns re verse recovery rise time t b 15 dt . www. daysemi.jp
3 typica l characteristics 25 c, unless otherwise noted ou tput characteristics on-resistance vs. drain current gate charge 0 10 20 30 40 50 60 01 2345 v ds - drain-to-so urce v oltage ( v) - drain c u rrent (a) i d v gs = 10 v thru 5 v v gs =4v v gs =3 v 0.00 0.01 0.02 0.03 0.04 0.05 0 102030405060 - on -resistance ( ) r ds( on) i d - drain c u rrent (a) v gs =1 0v v gs =4 .5 v 0 2 4 6 8 10 0 1020304050 i d =1 0a - gate -to-so urce v oltage ( v ) q g - total gate charge (nc) v gs v ds =1 0v v ds =2 0v v ds =1 5v t ransfer characteristics capacitance on-resistance vs. junction temperature 0 1 2 3 4 5 0 12345 v gs - gate-to-so urce v oltage ( v ) - drain c u rrent (a) i d v gs = 125 c v gs = 25 c v gs = - 55 c c rss 0 600 1200 1800 2400 3000 0 6 12 1 8 24 30 c is s v ds - drain-to-so urce v oltage ( v) c - capacitance (pf) c oss 0.6 0.8 1.0 1.2 1.4 1.6 - 50 - 25 0 25 50 75 100 125 150 t j -j unction temperat u re (c) (normalized) - on -resistance r ds(on ) v gs =- 10 v i d =1 0a v gs = - 4.5 v dt . daysemi.jp
4 ty pical characteristics 25 c, unless otherwise noted so urce-drain diode forward voltage threshold voltage 0.0 0.2 0.4 0.6 0. 8 1.0 1.2 v sd - source -to-drain v oltage ( v) - source cu rrent (a) i s 1 0.01 0.001 0.1 10 100 t j = 25 c t j = 150 c - 0.4 - 0.2 0.0 0.2 0.4 0.6 0.8 - 50 - 25 0 25 50 75 100 125 150 i d = 250 a v ariance (v) v gs( th) t j - temperat u re (c) i d =5m a on-resistance vs. gate-to-source voltage single pulse power, junction-to-ambient 0.00 0.02 0.04 0.06 0.08 0.10 02 46 8 10 - on -resistance ( ) r ds(on) v gs - gate-to-so urce v oltage ( v ) t j = 25 c t j = 125 c i d =1 0a 0 10 20 30 40 50 pow er ( w ) t ime (s) 10 1000 0.1 0.01 0.001 100 1 safe operating area 0.01 1 100 0.01 - drain c u rrent (a) i d 0.1 v ds - drain-to-so urce v oltage ( v) * v gs > minimu m v gs at which r ds(on) is specified 1m s 10 ms 100 ms 0 . 111 0 10 t a = 25 c single p ulse limited byr ds(on) * 1s 10 s dc 100 dt . daysemi.jp
5 typica l characteristics 25 c, unless otherwise noted * t he power dissipation p d is based on t j( max) = 150 c, using junction-to-case thermal resi stance, and is more useful in settling the upper dis sipation limit for cases where additional heatsinking is used. it is used to determine the current rating, when this rating falls below the package limit. cu rrent derating* 0 3 6 9 12 15 0 25 50 75 100 125 150 t c - case temperat u re (c) i d - drain c u rrent (a) pow er, junction-to-foot 0.0 1.4 2.8 4.2 5.6 7.0 0 25 50 75 100 125 150 t c - case temperat u re (c) pow er dissipation ( w ) po wer derating, junction-to-ambient 0.0 0.4 0.8 1.2 1.6 2.0 0 25 50 75 100 125 150 t a -a m b ient temperatu re (c) pow er dissipation ( w ) dt . daysemi.jp
6 ty pical characteristics 25 c, unless otherwise noted no rmalized thermal transient impedance, junction-to-ambient 10 -3 10 -2 1 10 1000 10 -1 10 -4 100 0.2 0.1 0.05 square w avep ulse du ration (s) normalized effecti v e transient thermal impedance 1 0.1 0.01 single pulse t 1 t 2 notes: p dm 1. d u ty cycle, d = 2. per unit base = r thja = 8 5 c/ w 3. t jm -t a =p dm z thja (t) t 1 t 2 4. su rface mo u nted d u t y cycle = 0.5 0.02 no rmalized thermal transient impedance, junction-to-foot 10 -3 10 -2 01 1 10 -1 10 -4 0.2 0.1 d u ty cycle = 0.5 square w avep u lse du ration (s) normalized effecti v e transient thermal impedance 1 0.1 0.01 0.02 single pulse 0.05 dt . daysemi.jp
www. daysemi.jp 1 dim millimeters inch es min max min max a 1.35 1.7 5 0.053 0.069 a 1 0.10 0.2 0 0.00 4 0.008 b 0.35 0.51 0.014 0.020 c 0.19 0.25 0.0075 0.010 d 4.80 5.00 0.189 0.196 e 3.80 4.00 0.150 0.157 e 1.27 bsc 0.050 bsc h 5.80 6.20 0.228 0.244 h 0.25 0.50 0.010 0.020 l 0.50 0.93 0.020 0.037 q0 8 0 8 s 0.44 0.64 0.018 0.026 ecn: c-06527-rev. i, 11-sep-06 dwg: 5498 4 3 1 2 5 6 8 7 h e h x 45 c all le a d s q 0.101 mm 0.004" l ba 1 a e d 0.25 mm (g a ge pl a ne) s oic (narrow): 8-lead jedec p a rt n u m b er: m s -012 s package information
www .daysemi.jp 1 application note recommen ded minimum pads for so-8 0.246 (6.248) recommended mi nimum pads dimensions in inches/(mm) 0.172 (4.369) 0.152 (3.861) 0.047 (1.194) 0.028 (0.71 1) 0.050 (1.270) 0.022 (0.559) return to index r e turn to index application note
legal disclaimer notice www. daysemi.jp 1 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards. legal disclaimer notice www.daysemi.jp revision: 02-oct-12 1 document number: 72610 disclaimer all product, product specifications and data are subject to change without notice to improve reliability, function or design or otherwise. din-tek intertechnology, inc., its affiliates, agents, and employee s, and all persons acting on it s or their behalf (collectivel y, din-tek ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any o ther disclosure relating to any product. din-tek makes no warranty, repres entation or guarantee regarding the suitabilit y of the products for any particular purpose or the continuing production of any product. to the maximum extent permitted by applicable law, din-tek disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation specia l, consequential or incidental damages, and (iii) any and all i mplied warranties, including warra nties of fitness for particular purpose, non-infringement and merchantability. statements regarding the suitability of products for certain type s of applications are based on din-tek s knowledge of typical requirements that are often placed on din-tek products in generic applications. such statements are not binding statements about the suitability of products for a particular application. it is the customers responsib ility to validate that a particu lar product with the properties descri bed in the product specification is suitable fo r use in a particular application. parameters provided in datasheets and/or specification s may vary in different applications an d performance may vary over time. all operating parameters, including typical pa rameters, must be validated for each customer application by the customers technical experts. product specifications do not expand or otherwise modify din-tek s terms and condit ions of purchase, including but not limited to the warranty expressed therein. except as expressly indicate d in writing, din-tek products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the din-tek product could result in personal injury or death. customers using or selling din-tek products not expressly indicated for use in such applications do so at their own risk. pleas e contact authorized din-tek personnel to ob tain written terms and conditions regarding products designed for such applications. no license, express or implied, by estoppel or otherwise, to any intellectual prope rty rights is granted by this document or by any conduct of din-tek . product names and markings noted herein may be trad emarks of their respective owners. material category policy din-tek intertechnology, inc. hereby certi fies that all its products that are id entified as rohs-compliant fulfill the definitions and restrictions defined under directive 2011/65/eu of the euro pean parliament and of the council of june 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (eee) - recast, unless otherwis e specified as non-compliant. please note that some din-tek documentation may still make reference to rohs directive 2002/95/ ec. we confirm that all the products identified as being compliant to directive 2002 /95/ec conform to directive 2011/65/eu. din-tek intertechnology, inc. hereby certifi es that all its products that are identified as ha logen-free follow halogen-free requirements as per jedec js709a stan dards. please note that some din-tek documentation may still make reference to the iec 61249-2-21 definition. we co nfirm that all the products identified as being compliant to iec 61249-2-21 conform to jedec js709a standards.
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